Technology innovation
Our history has enabled us to always work with innovative technology and ultra-modern developments.
We design with the most modern printed circuits and packaging technologies
• Rigid PCB designs, crosstalk and impedance control.• High density interconnection (HDI) with sequenced construction multi-layer technology (SBU).
• Blind vias, buried vias, and microvias.
• Stacked vias with copper filling.
• Design with Materials of High Performance, like Megtron 6, Rogers or Arlon.
• Hybrid stackups w/,FR4, Teflon (PTFE), Polyimide Kapton © and BT Epoxy.
• Flex and Rigi-Flex boards.
• Thermal management with metallic substrate (IMS).
• Thermal management with metallic core (MCPCB).
• ELIC Technology (Every Layer Inter-Connection).
• Optical PCBs.
• BGA, microBGA (fine pitch), LGA, Package-On-Package (PoP) and other .
• Embedded components.
• Cavity Boards .
• Mezzanine connectors and other high-density Ultra Fine Pitch connectors.